Exchange the CEC enclosure system backplane

Before you begin

CAUTION:

This assembly contains mechanical moving parts. Use care when you service this assembly. (C025)

Icon for electrostatic discharge wrist strap Use approved ESD procedures to prevent damage.

Attention:

This procedure is not a stand-alone procedure. Customer disruption and damage to the hardware might occur when microcode and power boundaries are not in the proper conditions for this service action.
If a serviceable event FRU repair directed you to this procedure, the microcode and power boundaries are already set.
If a serviceable event FRU repair did not direct you to this procedure, see MAP1230 Replace a FRU without using a serviceable event.

Notes:

All the cables and FRUs to be removed must be uniquely identified so they can be reinstalled correctly.
If an installed earthquake resistance kit prevents you from accessing this FRU, refer to MAP1600.

Preparing the CEC enclosure to remove and replace the system backplane

Procedure

Use a replacement part with a valid DS8000® part number to ensure it has the proper firmware, VPD, and/or configuration to ensure it is compatible with the DS8000 service procedures. Attempting to use a generic server FRU might fail and require next level of support to recover.
All parts being removed must be marked or identified so they can be installed into their original locations.
Note: Failure to do this can extend the service duration and may require next level of support assistance.
The management console keyboard can be moved between the operating and stowed position as needed to allow service clearance above the CEC enclosure.
Use the front and rear blue identify LEDs to determine the CEC enclosure to be repaired. Both blue LEDs should be lit.
- CEC control panel blue identify LED as shown in Figure 1.
- CEC enclosure rear blue identify LED as shown in Figure 2.
Note: If both the front and rear CEC enclosure identify LEDs are not lit, use the location code listed in the serviceable event FRU list. See MAP1245 Finding FRUs by using location codes.

Figure 1. Control panel LEDs

Figure 2. CEC enclosure rear LEDs
Verify that the CEC enclosure is in the power-off state. See Figure 3
1. At the rear of the CEC enclosure, view all CEC enclosure power supply DC LEDs.
2. Are all DC (output) LEDs flashing?
  - Yes, continue with the next step.
  - No, do not continue with this FRU replacement. Go to MAP4841 CEC enclosure fails to power off during service processor repair (Models 961, 98x).
Figure 3. Location of the power supplies and LEDs (Models 980, 983, 984)
Attach the electrostatic discharge (ESD) wrist strap.
Attention:
- Attach an electrostatic discharge (ESD) wrist strap to an unpainted metal surface of your hardware to prevent the electrostatic discharge from damaging your hardware.
- When using an ESD wrist strap, follow all electrical safety procedures. An ESD wrist strap is used for static control. It does not increase or decrease your risk of receiving electric shock when using or working on electrical equipment.
- If you do not have an ESD wrist strap, just prior to removing the product from ESD packaging and installing or replacing hardware, touch an unpainted metal surface of the system for a minimum of 5 seconds.
Disconnect the power cords from the CEC with the DC (output) LEDs flashing. See Figure 4.
Notes:
- Ensure the power cords are correctly labeled.
- The power supply LEDs might continue to flash for up to 20 seconds while internal power is discharged.
- The power cord is fastened to the system using the hook-and-loop fastener . Unstrap the fastener to allow the enclosure to be placed in the service position.
Figure 4. Removing the power cords (Models 980, 983, 984)
Observe the CEC enclosure control panel green power button LED . See Figure 5.
- If it is off, go to the next step.
- If it is flashing, the CEC enclosure is still in the power-off state. DO NOT CONTINUE. Ensure that you have unplugged the power cables.
Figure 5. Control panel LEDs

Disconnect all remaining cables from the rear of the CEC enclosure. See Table 1 and Figure 6.

Table 1. CEC enclosure cable connections
Connection	Description
P1-T1 (HMC 1)	FSP Ethernet
P1-T2 (HMC 2)	FSP Ethernet
P1-C6-T1, P1-C6-T2	PCIe to I/O enclosures (Model 980, 984)
P1-C7-T1, P1-C7-T2	PCIe to I/O enclosures (Model 980, 984)
P1-C7-T1, P1-C7-T2, P1-C7-T3, P1-C7-T4	PCIe to I/O enclosures (2U) (Model 983)
P1-C8-T1, P1-C8-T2	i2c to RPCs
P1-C10-T1, P1-C10-T2	LPAR Ethernet
P1-C10-T3, P1-C10-T4	Customer network (optional feature, if used)
P1-C11-T1, P1-C11-T2 P1-C11-T3, P1-C11-T4	Customer network (optional feature, if used)
P1-C12-T1, P1-C12-T2	RS485 to RPCs

Remove filler plugs (if present) at the rear of the CEC enclosure. See Figure 6.
1. Remove the filler plugs (if present) from USB ports P1-C1-T2, P1-C1-T3 and serial port P1-C1-T1.
2. Remove the filler plugs (if present) from Ethernet ports P1-C10-T3 and P1-C10-T4.
3. Remove the filler plugs (if present) from Ethernet ports P1-C11-T1, P1-C11-T2, P1-C11-T3, and P1-C11-T4.
Figure 6. CEC enclosure location codes (rear view) (Models 980 and 984)
If a 10 Gb Ethernet adapter is present in location P1-C11, remove the two optical SFPs. Removing the two optical SFPs allows removal of the adapter later in this procedure.
1. Remove the dust covers from the SFPs.
2. Grasp the latch at the right side of each SFP, and move it to the left to unlatch the SFP.
3. Slide each SFP out of the adapter.
4. Close the latch and replace the dust cover on each SFP.
Remove the power supplies.
Note: Place all removed components that will be reinstalled later in this procedure, on an electrostatic discharge (ESD) mat.
1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
2. To unseat the power supply from its position in the system, push the terracotta locking-tab in the direction shown in Figure 7.
3. Pull the power supply away from the system, as shown in Figure 7.
Figure 7. Removing a CEC enclosure power supply
Remove the front cover.
1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
2. Remove the two shipping screws (if present) that secure the system to the rack.
3. Pull the cover away from the system. The cover has an indentation where you can hold onto it more easily.
Figure 8. Removing the front cover
Place the CEC enclosure into the service position.
1. Remove the front screws (if present) that secure the enclosure to the rack.
  Figure 9. Removing the front screws
2. Release the side latches and pull the latches to slide out the enclosure assembly.
  Figure 10. Releasing the side latches
Remove the service access cover.
1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
2. Release the latch by pushing the release latch in the direction shown.
3. Slide the cover off the system unit. When the front of the service access cover has cleared the upper frame ledge, lift the cover up and off the system unit.
  Attention: For proper cooling and airflow, replace the cover before turning on the system.
Figure 11. Removing the service access cover
Remove the control panel. Press the terracotta tab and then slide the control panel straight out of the slot.
Figure 12. Removing the control panel
Remove the Slimline media device (DVD), if present.
1. Press the retaining tab toward the system until the Slimline media device is unseated from the media bay. See Figure 13.
2. Pull the Slimline media device away from the system, in the direction shown.
Figure 13. Removing the Slimline media device
Unplug but do not remove the disk drives from their slots. Pull the drives out far enough to prevent them from interfering with the removal of the disk drive backplane.
1. Unlock the drive handle by pressing the handle latch and pulling it out toward you, as shown in Figure 14. If the handle is not all the way out, the drive cannot slide out of the system.
2. Support the bottom of the drive as you slide it out of the system. Hold the drive by its sides.
Figure 14. Removing a disk drive

Removing the CEC enclosure system backplane

About this task

To remove the CEC enclosure system backplane, complete the following steps:

Procedure

Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
Remove the fan cage.
1. Release the blue touch point latches by pulling them up, as shown in Figure 15. This action unseats the fan cage.
2. Pull up the fan cage out of the system by holding on to the blue touch point latches .
Figure 15. Removing the fan cage
Label the front SAS cables, paying attention to the connectors each cable attaches to on the disk drive backplane and the SAS RAID internal adapter. Disconnect the front SAS cables from the disk drive backplane by pressing the latch and unplugging the cable as shown in Figure 16.
Figure 16. Disconnecting the front SAS cables
Unseat the front SAS cables from the cable guide on the side of the system chassis. See Figure 17.
Figure 17. Unseating the SAS cables
Label, disconnect, and remove the signal, and control panel cables , and the power Y cable , from the disk drive backplane and system backplane. See Figure 18.
Figure 18. Removing the power, signal, and control panel cables
Carefully unscrew the disk drive backplane's captive thumbscrews until fully loose as shown in Figure 19.
Tilt the disk drive backplane in the direction that is shown and then slide it to the side so that the disk drive backplane cutouts clear the tabs in the chassis.
Remove the disk drive backplane.
Figure 19. Removing the disk drive backplane
Remove the PCIe3 x8 SAS RAID internal adapter 6 Gb and the front SAS cables from slot P1-C14.
1. Lift the two cable retention brackets in the direction shown. See Figure 20.
2. Lift the blue handles in the direction shown. See Figure 20.
3. Lift the SAS RAID internal adapter out of the slot with the front SAS cables still connected to the adapter. Ensure that the front SAS cables do not get caught on any components while you are lifting the SAS RAID internal adapter out of the slot.
Figure 20. Removing the SAS RAID internal adapter
Remove the filler from slot P1-C15.
Remove the time-of-day battery from its corresponding slot on the system backplane, as shown in Figure 21. Ensure to record the orientation of the polarity of the battery so that you can insert it with the same orientation later.
Note: The orientation of the + of the battery is towards the power supplies or middle of the system.

Attention: When removing the battery, do not use a metallic tool to disengage it from its slot.

Figure 21. Removing the time-of-day battery
Remove the VPD card. Grasp the VPD card by the plastic housing and pull it out of its slot in location P1-C13 on the system backplane as shown in Figure 22.
Figure 22. Removing the VPD card
Label and remove the memory modules, then remove the memory module fillers.

Important: In a CEC enclosure with two system processor modules, the memory module pairs might be installed in a different order than the one shown on the inside of the service access cover.
Record and use the actual location of each memory module.
1. Record the location of each memory module, then remove the module. Each module must be installed in the same location on the new system backplane.
2. To unlock the memory module from its connector in the slot, push the locking tabs in the direction that is shown in Figure 23. The lever action of the tabs forces the memory module out of the connector.
3. Hold the memory module by the edges and pull it out of the system.
4. Repeat steps b and c to remove the memory module fillers.
Figure 23. Removing a memory module from the system
Label and remove the system processor modules and heat sinks, starting with P1-C32.
1. Remove the air baffle by grasping the baffle and lifting it out of the system as shown in Figure 24.
  Figure 24. Removing the air baffle
2. Remove the heat sink.
  1. Loosen the heat sink actuation screw by turning the supplied 5.5 mm nut driver (part number 43W3032) counterclockwise until the screw becomes loose and moves freely as shown in Figure 25.
  2. Grip the heat sink by the grooves on opposing sides and remove it by lifting straight up.
  3. Inspect the heat sink for any dust or debris on it. If you must remove dust or debris from the heat sink, it must be done in another room or greater than 25 feet (7.62 meters) away from work area.
  4. Place the heat sink upside down on an electrostatic discharge (ESD) surface.
  Figure 25. Removing the heat sink
3. Remove dust and debris from the system processor module area.
  1. If dust or debris is present, use the supplied air pump (part number 45D2645) to clean the system processor module area. Blow small bursts of air from the center toward the sides of the system processor module as shown in Figure 26.
  Figure 26. Removing dust and debris from the system processor module area
4. Prepare the system processor module for removal.
  1. Using the supplied removal tool (part number 00E8483), align the beveled corner of the tool over the beveled corner of the system processor module as shown in Figure 27.
  2. Lower the tool over the system processor module by ensuring the two guide pins are inserted into the alignment holes on each side of the tool.
    Figure 27. Lowering the removal tool onto the system processor module
  3. With the removal tool sitting on top of the system processor module, push down on the tool to lock the system processor module into the tool, as shown in Figure 28. Make sure that both of the tool jaws are locked on the system processor module. Do not press the blue release tabs until directed to do so later.
    Note: The tool drops slightly when you push down so that the jaws can grab the bottom of the system processor module.
    
    Figure 28. Locking the system processor module into the tool
5. Holding the outside of the tool, lift the tool and system processor module from the socket. Place them at an angle in the top cover of the system processor module packaging (if available), or other appropriate ESD surface, as shown in Figure 29.
  Note: Setting the tool and system processor module at an angle on the top cover of the system processor module packaging will make it easier to pick up and place in the packaging after you replace the system processor module.
  
  Figure 29. Placing the tool at an angle on the top cover of the packaging
6. Squeeze the two blue tabs to release the system processor module from the tool. See Figure 30.
  Note: To prevent the system processor module from falling, do not squeeze the two tabs before you place the tool on the top cover of the system processor module packaging.
  
  Figure 30. Releasing the system processor module from the tool
7. If a second system processor module is present in P1-C33, repeat the steps above to remove the second system processor module.
Disconnect the I2C cable from the I2C interface card in location P1-C8. Route the cable over the right side of the system and out of the way to provide clearance for removing the system backplane. It may be necessary to remove the I2C interface card to disconnect the cable.
Remove the system I/O card.
1. Rotate the locking lever in the direction shown in Figure 31 to unlock the system I/O card from the slot in the system rear bulkhead.
2. Pull out the system I/O card from the slot by holding the card bracket and by supporting the bottom of the card.
Figure 31. Removing the system I/O card
Disconnect and remove the power distribution signal cable from the rear of the power supply assembly and the system backplane connector. See Figure 32.
Figure 32. Removing the power distribution signal cable

Label and remove the PCIe adapters.

Table 2. Location and description of PCIe adapters
Location	Description
C6	PCIe two-port card (Model 980, 984)
C7	PCIe two-port card (Model 980, 984)
C7	PCIe four-port card (Model 983)
C8	I2C interface card
C10	Ethernet adapter
C11	Ethernet adapter, 10 Gb and 1 Gb (if installed)
C12	RS485 serial interface card

To set the adapter latch at the target slot into the open position, rotate the latch on the rear of the system, in the direction shown in Figure 33.
Carefully grasp the adapter by its top edge or tailstock, and remove the adapter from the slot, as shown in Figure 33.
Attention: A pin on the tailstock of the adapter resembles a removable screw. Do not remove this pin. It is required for correct alignment and seating.

Note: Remove and reinstall any adapter port filler plugs as required.

Figure 33. Removing a PCIe adapter from a rack-mounted system
Place the removed adapter on an approved ESD surface.

If you removed a 10 Gb Ethernet adapter, replace the optical SFPs.
1. Remove the dust covers from the SFPs.
2. Open the latch of each SFP.
3. Slide each SFP into the adapter.
4. Close the latch and replace the dust cover on each SFP.
Remove the PCI adapter dividers.
Note: The PCI adapter divider between PCI adapter slots P1-C1 and P1-C2 is unique and has three light pipes. This divider must be replaced into the same location.
1. Hold the top edge of the PCI adapter divider and flex the divider out of the bracket and toward the rest of the divider. See Figure 34.
2. Press down on the retaining latch at the back edge of the divider . Pull the divider away from the system chassis, then lift out to remove it from the system.
3. Repeat this step to remove remaining PCI adapter dividers.
Figure 34. Removing the PCI adapter dividers
Remove the SAS cable guide. Grasp the tab of the guide and pull it out and away from the side of the chassis. Pull the guide toward the front of the system until the slots on the guide clear the pins on the side of the chassis, then remove the guide. See Figure 35.
Figure 35. Removing SAS cable guide
Remove the system backplane.
1. Using a Phillips screwdriver, unscrew and remove 12 screws that mount the system backplane to the chassis as shown in Figure 36.
  Figure 36. System backplane screw locations
2. Using a Phillips screwdriver, unscrew and remove four screws from the sides of the system chassis as shown in Figure 37.
3. Grasp the system backplane by the top guide rail . Slide it forward in the direction that is shown, then lift it up to remove it from the chassis. See Figure 37.
  Figure 37. Removing the system backplane

Replacing the CEC enclosure system backplane

About this task

To replace the system backplane, complete the following steps:

Procedure

Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
Install the system backplane.
1. Grasp the top guide rail and lower the backplane into position while you are sliding it toward the rear as shown in Figure 38.
2. Using a Phillips screwdriver, install and tighten four screws to secure the backplane to the side of the chassis as shown in Figure 38.
  Figure 38. Installing the system backplane
3. Using a Phillips screwdriver, install and tighten 12 screws to secure the backplane to the base of the chassis. See Figure 39.
  Figure 39. System backplane screw locations
Replace the SAS cable guide by inserting the slots on the guide over the pins on the chassis. Grasp the tab of the guide and push the guide toward the rear of the system. Push the guide back until the slots are seated on the pins and the tab of the cable guide latches. See Figure 40.
Figure 40. Replacing SAS cable guide
Replace the PCI adapter dividers.
Note: One PCI adapter divider is unique. It has three light pipes and must be installed in the location between PCI adapter slots P1-C1 and P1-C2.
1. Holding the top edge of the PCI adapter divider , align the divider with its slot in the system.
2. Slide the divider toward the retention notches as shown in Figure 41.
3. Ensure that the tabs on the divider align with the notches on the system chassis.
  Note: The light pipes below the light-pipe plate must fit through the holes in the plate.
4. Press on the divider until the lower edge guide pin slides into the slot to secure the divider.
5. Repeat this step for the other PCI adapter dividers to be installed.
Figure 41. Installing the PCI adapter dividers

Replace the PCIe adapters.

Table 3. Location and description of PCIe adapters
Location	Description
C6	PCIe two-port card (Model 980, 984)
C7	PCIe two-port card (Model 980, 984)
C7	PCIe four-port card (Model 983)
C8	I2C interface card
C10	Ethernet adapter
C11	Ethernet adapter, 10 Gb and 1 Gb (if installed)
C12	RS485 serial interface card

If the adapter latch at the target slot is not already in the open position, pull the latch into the open position by rotating the latch outwards from its clip on the back of the system, as shown in Figure 42.

Attention: A pin on the tailstock of the adapter resembles a removable screw. Do not remove this pin. It is required for correct alignment and seating.

Note: Remove and reinstall any adapter port filler plugs as required.

Note: If you are installing a 10 Gb Ethernet adapter, you might need to remove the dust covers from the SFPs. Replace the dust covers after installing the adapter.
Carefully grasp the adapter by its top edge or tailstock, and align the adapter with the slot and its connector on the system backplane, as shown in Figure 42.
On the system, press the adapter firmly into its connector.
To lock the adapter in its slot, rotate the adapter latch in the direction that is shown in Figure 42.

Figure 42. Installing or replacing a PCIe adapter in a rack-mounted system

Reconnect the I2C cable to the I2C interface card in location P1-C8. This cable was disconnected and routed over the right side of the system to allow clearance for removing and reinstalling the system backplane. It may be necessary to remove the I2C interface card to reconnect the cable, then reinstall the I2C interface card.
Reconnect the power distribution signal cable to the rear of the power supply assembly and the system backplane connector. See Figure 43.
Figure 43. Replacing the power distribution signal cable
Replace the system I/O card.
1. With the blue locking latch in the open position, align the system I/O card with the guide rails on the system and slide the card straight into the card slot, as shown in Figure 44.
2. Rotate the blue locking latch in the direction shown in Figure 44 to lock the system I/O card in position.
Figure 44. Replacing the system I/O card in a rack-mounted system
Replace the system processor modules and heat sinks, starting with P1-C32.
1. Prepare the system processor module for installation:
  1. Remove the replacement processor module from the shipping tray. Using the supplied removal tool (part number 00E8483), align the beveled corner of the tool over the beveled corner of the module, as shown in Figure 46.
  2. Lower the tool over the system processor module by ensuring that the two guide pins are inserted into the alignment holes on each side of the tool, as shown in Figure 46. Then, push down on the tool to lock the system processor module into the tool, as shown in Figure 45. Do not press the blue release tabs until directed to do so later.
  Figure 45. Preparing for system processor module installation
  
  Figure 46. Locking the system processor module into the tool
2. Prepare for system processor module installation:
  1. Grasping the sides of the tool and system processor module, carefully lift it slightly out of the system processor module tray. Then, turn it over so that the system processor module side is up.
  2. Ensure that both jaws are firmly grabbing the system processor module, as shown in Figure 47.
    Note: If both jaws are not firmly grabbing the system processor module, press down on the corner of the system processor module closest to the jaw until it locks into place. Do not touch any part of the system processor module other than the corners.
  Figure 47. Preparing for system processor module installation
3. Install the system processor module:
  1. Lower the tool and system processor module onto the socket, ensuring that the two guide pins are inserted into the alignment holes on each side of the tool, as shown in Figure 48.
    Note: Do not attempt to slide the tool and the system processor module in any direction while the system processor module is touching the socket. If the tool and the system processor module are not aligned with the guide pins, lift the tool and the system processor module and reposition them.
    
    Figure 48. Installing the system processor module
  2. After the tool and system processor module holes and guide pins are properly aligned, squeeze and hold the two blue release tabs together until a firm stop is reached, as shown in Figure 49. Then, lift the tool off the system processor module.
    Figure 49. Removing the system processor module tool
4. Inspect the thermal interface material (TIM) for visible signs of damage, as shown in Figure 50.
  Note: When the heat sink is removed from the failed system processor module, the TIM should be adhered to the heat sink. Unless damaged, the TIM that is adhered to the heat sink can be reused. Replacing the TIM is optional and is only performed if the TIM is damaged. Do not reuse the removed heat sink if the TIM is damaged. Either discard the heat sink and the damaged TIM locally or return them to IBM based on part-order-form part status. It is recommended that a spare TIM and heat sink, part number 00FV742, be on hand when replacing the system processor module.
  
  Figure 50. Inspecting the thermal interface material
5. Install the heat sink:
  1. Lower the heat sink over the system processor module, ensuring that the two guide pins are inserted into the alignment holes on each side of the tool, as shown in Figure 51.
  2. Ensure that the heat sink load arm is engaged.
    Note: If the load arm is not engaged, you must manually engage the load arm onto the heat sink while the load screw is being tightened. See Figure 52.
  Figure 51. Installing the heat sink
6. Secure the heat sink:
  1. Upon placing the heat sink on the system processor module, ensure that the heat sink load arm on the side of the heat sink becomes engaged, as shown in Figure 52.
  2. While you are holding the heat sink in place, use the supplied 5.5 mm nut driver (part number 43W3032) to tighten the heat sink actuation screw. Turn the screw clockwise a few turns.
  3. Is the load arm still engaged?
    Yes: Continue turning the actuation screw clockwise until a firm stop is reached. If a torque tool is available, tighten the screw to 2.5 nm.
    
    No: Unscrew the actuation screw. Hold the load arm onto the heat sink while you are tightening the screw until a firm stop is reached. If a torque tool is available, tighten the screw to 2.5 nm.
    
    Note: If during this step, the heat sink moves noticeably, it is likely that the load arm is not engaged. If the heat sink moves noticeably, unscrew the actuation screw and hold the load arm onto the heat sink while you are tightening the screw until a firm stop is reached. If a torque tool is available, tighten the screw to 2.5 nm.
  Figure 52. Securing the heat sink
If a second system processor module was removed from P1-C33, repeat the steps above to install the second system processor module. Otherwise, install a processor slot cover if a cover is not already present.
Replace the air baffle by lowering it into position as shown in Figure 53.
Figure 53. Replacing the air baffle
Replace the memory modules and slot fillers.

Important: In a CEC enclosure with two system processor modules, the memory module pairs might be installed in a different order than the one shown on the inside of the service access cover.
Use the slot information that you recorded.
1. Use the slot information that you recorded to determine the slot location to place the memory modules and fillers.
2. Grasp each memory module along its edges and align it with the slot.
  Attention: Memory modules are keyed to prevent a memory module from being installed incorrectly. Note the location of the key tab within the memory module connector before you attempt to install the memory module.
3. Press the memory module firmly into the slot until the locking tab locks in place. See Figure 54.
4. Repeat steps b and c to replace the remaining memory modules and install slot fillers in the remaining slots.
Figure 54. Installing or replacing a memory module
Replace the VPD card. Insert the VPD card into its slot in location P1-C13 on the system backplane as shown in Figure 55. Push the VPD card into place until it is fully seated.
Figure 55. Replacing the VPD card
Replace the time-of-day battery. Insert the time-of-day battery in the slot on the system backplane, as shown in Figure 56. Ensure to insert the battery with the correct polarity as recorded during removing of the battery.
Note: The orientation of the + of the battery is towards the power supplies or middle of the system.

Figure 56. Inserting the time-of-day battery
Complete the disk drive backplane installation.
1. Using the ledge at the top of the disk drive backplane and facing towards the front of the system, replace the backplane by tilting it towards the rear and lowering it down into the chassis.
2. Align the backplane cutouts with the tabs in the chassis to insert it into the system.
3. Shift the backplane slightly to the left to secure it in place, as is shown in Figure 57.
4. Carefully tighten each of the disk drive backplane's captive thumbscrews until each one is secured to the system's chassis.
Figure 57. Replacing the disk drive backplane
Reconnect the signal and control panel cables , and the power Y cable to the disk drive backplane and the system backplane as shown in Figure 58.
Figure 58. Reconnecting the power, signal, and control panel cables
Replace the PCIe3 x8 SAS RAID internal adapter 6 Gb. Do not connect the front SAS cables to the disk drive backplane at this time.
1. Reconnect the front SAS cables to the SAS RAID internal adapter front connector, if not already connected, before you install the adapter. Push the cable connector in until the connector latch clicks.
2. Route the front SAS cables into position while you are lowering the SAS RAID internal adapter into the slot.
3. Complete the installation of the SAS RAID internal adapter by fully seating it. Ensure that the adapter is installed on the locating pin . Press the top-center edge of the card down to firmly seat it into the system backplane connector, as shown in Figure 61.
4. Push the blue handles in the direction that is shown in Figure 59.
5. Push the cable retention bracket in the direction that is shown in Figure 59.
  Figure 59. Installing or replacing the SAS RAID internal adapter
Replace the filler in slot P1-C15.
Reseat the front SAS cables into the guide block on the side of the chassis as shown in Figure 60.
Figure 60. Reseating the front SAS cables
Reconnect the front SAS cables to the disk drive backplane as is shown in Figure 61. Push the connector in until the connector latch clicks.
Figure 61. Reconnecting the front SAS cables

Note: With one PCIe3 x8 SAS RAID internal adapter (CCIN 57D7) in slot P1-C14 (base-storage feature), one SAS cable connects the lower disk drive backplane connector (J1) to the P1 connector on the adapter. A SAS cable connects the upper disk drive backplane connector (J2) to the P2 connector on the same adapter. See Figure 62.

Figure 62. Reconnecting the SAS cable in a base-storage configuration
Replace the fan cage with the fans installed.
1. Ensure that there are no cables obstructing the fan cage installation area.
  Important: Failure to ensure that the cables are tucked out of the way can damage the cables.
2. Lower the fan cage into the system by holding on to the blue touch point latches , as shown in Figure 63.
3. Push down on the fan cage to seat in the system.
4. Rotate the latches as shown in Figure 63, to lock the fan cage in place.
Figure 63. Replacing the fan cage in a rack-mounted system

Preparing the CEC enclosure for operation after removing and replacing the system backplane

About this task

To prepare the system for operation, complete the following steps:

Procedure

Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
Replace the service access cover.
1. Slide the cover on to the system unit.
2. Close the latch release by pushing it in the direction shown.
Figure 64. Installing the service access cover
Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
Reseat the disk drives into their slots.
1. Unlock the drive bay handle by pressing it and pulling it out toward you. If the handle is not all the way out, the drive does not slide into the system. See Figure 65.
2. Hold the drive by the top and bottom edges as you position the drive, and insert it into the drive slot.
3. Slide the drive all the way into the system, and push the drive bay handle in until it locks, as shown in Figure 65.
  Important: Ensure that the drive is fully seated and is all the way into the system.
Figure 65. Replacing a disk drive
Replace the Slimline media device (DVD) (if one was removed).
1. Align the Slimline media device with the media bay, and support the bottom of the device as you slide it halfway into the system. See Figure 66.
2. Push the Slimline media device fully into the system until the device locks in place.
Figure 66. Replacing a Slimline media device
Replace the control panel.
1. Align the control panel with the control panel slot.
2. Slide the control panel into the slot, and press on the terracotta tab to lock it in place.
Figure 67. Replacing the control panel
Place the CEC enclosure into the operating position.
1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
2. Unlock the blue rail safety latches by lifting them upward.
3. Push the system unit back into the rack until both system unit release latches lock into position.
4. Secure the enclosure to the rack with screws, if screws were removed when preparing the enclosure for service.
Figure 68. Placing the CEC enclosure into the operating position
Replace the front cover.
1. Slide the cover onto the system.
2. Close the release latches by pushing in the direction shown in Figure 69. The cover snaps into place and has an indentation where you can hold onto it more easily.
3. Replace the shipping screws .
Figure 69. Installing the front cover
Attach the electrostatic discharge (ESD) wrist strap.
Replace the power supplies. DO NOT connect the power cords at this time.
Align each power supply with the bay and slide the power supply into the system until the terracotta latch locks in place, as shown in Figure 70.
Figure 70. Replacing a power supply

Reconnect all cables, except for power cords. See Table 4 and Figure 71.

If optical Ethernet connections are used, use proper cleaning procedures.

Important: The optical cable plugs (LC connectors) and ports (SFPs) must be cleaned before connecting them. Use cleaning tool 54Y4392 or IBM-approved alternative. After cleaning SFPs with the tool, use air bulb 45D2645 or IBM-approved alternative. For detailed procedures, refer to current DS8000 Info Alerts or contact your next level of support.

Table 4. CEC enclosure cable connections
Connection	Description
P1-T1 (HMC 1)	FSP Ethernet
P1-T2 (HMC 2)	FSP Ethernet
P1-C6-T1, P1-C6-T2	PCIe to I/O enclosures (Model 980, 984)
P1-C7-T1, P1-C7-T2	PCIe to I/O enclosures (Model 980, 984)
P1-C7-T1, P1-C7-T2, P1-C7-T3, P1-C7-T4	PCIe to I/O enclosures (2U) (Model 983)
P1-C8-T1, P1-C8-T2	i2c to RPCs
P1-C10-T1, P1-C10-T2	LPAR Ethernet
P1-C10-T3, P1-C10-T4	Customer network (optional feature, if used)
P1-C11-T1, P1-C11-T2 P1-C11-T3, P1-C11-T4	Customer network (optional feature, if used)
P1-C12-T1, P1-C12-T2	RS485 to RPCs

Replace filler plugs (if removed) at the rear of the CEC enclosure. See Figure 71.
1. Replace the filler plugs in USB ports P1-C1-T2, P1-C1-T3 and serial port P1-C1-T1.
2. Replace the filler plugs in Ethernet ports P1-C10-T3 and P1-C10-T4.
3. Replace the filler plugs in Ethernet ports P1-C11-T1, P1-C11-T2, P1-C11-T3, and P1-C11-T4.
Figure 71. CEC enclosure location codes (rear view) (Models 980 and 984)
Reconnect the power cords to the CEC enclosure. See Figure 72.
Fasten the power cords to the enclosure using the hook-and-loop fasteners .
Figure 72. Connecting the power cords
Verify that the CEC enclosure has power available. See Figure 73.
1. At the rear of the CEC enclosure, view the CEC enclosure power supply DC LEDs.
2. Are all DC (output) LEDs flashing?
  - Yes, continue with the next step.
  - No, ensure the power cords are properly connected. If no connection problem is found, contact your next level of support.
Figure 73. Location of the power supplies and LEDs (Models 980, 983, 984)
Wait up to 5 minutes for the CEC enclosure control panel power button LED to flash. See Figure 74.
Note: This ensures the CEC enclosure is in the power-off state.

Is the power button LED flashing?
- Yes, go to the next step.
- No, ensure the CEC enclosure power supplies are fully seated. The possible failing FRUs are the CEC enclosure system backplane, I2C interface card and cables, and control panel. You can also call the next level of support.
Figure 74. Control panel LEDs
Close the rear door of the rack.
Exit this service information center parts exchange procedure and return to the procedure that sent you here.